United States

System Design Engineer, Rancho Bernardo

System Design Engineer, Rancho Bernardo
Description
Do you love working on challenges that no one has solved yet? Do you like changing the game? Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there"s no telling what you could accomplish. In this role, you will own and drive the electrical and physical design of multi-layer boards for prototype systems, developing reference designs that meet stringent area, cost, and performance requirements for product development. Work with cross-functional team to understand system requirements, from both physical design limitations and performance requirements Develop physical design implementations meeting stringent power and signal integrity requirement Drive co-optimization of physical design on MLB and package Provide implementation guidelines and feedback to silicon, package, and system design groups Perform feasibility study, design verification, and sign-off. Create custom PDN and SI routing feasibility on the system level for product PI/SI performance verification and help develop droop requirements for the system.\\nWork with cross functional teams to incorporate requirements and system constraints to MLB routing feasibility layouts. \\nUse BKM to create layouts satisfying droop requirements for PI.\\nWork with Package team on codesign areas between MLB and Package design. BS and 10 years of relevant industry experience 4 years experience in physical design of multi-layer boards (MLBs).\\nExperience in circuit design, schematic capture, and system integration.\\nStrong physical understanding of power and signal integrity fundamentals. \\nExperience in the physical design of Power Delivery Networks (PDNs) and high-speed signals at PCB level. \\nFamiliar with Cadence APD/Allegro for physical design. \\nFamiliar with High Density Interconnect (HDI) PCB and Flip-Chip (FC) BGA package substrate technologies. Ability to work and communicate effectively in a multi-functional team.
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