Advanced Packaging Process Development Engineer - Staff, Kissimmee

Position Summary: As an Advanced Packaging Process Engineer, you will own all assigned process steps. The preferred candidate will have the ability to troubleshoot difficult and poorly defined problems in relation to the specific process disciplines assigned using tool knowledge/experience, SPC, qualifying data, and other available resources. The candidate will have extensive collaboration with the area maintenance team and equipment engineering. Some collaboration will be with tool vendors, other area engineers/managers, procurement, integration, and production. If you are a self-motivated team player, who thrives in a fast-paced, constantly changing environment, passionate about building great products and learning new technologies, this is the job for you! Major Areas of Accountability: Provide technical leadership and management of Advanced Packaging Semiconductor processes in Support of Fan Out Wafer Level Packaging, Interposers, Hybrid Wafer to Wafer bonding, and Die to Wafer Bonding. Highly desirable for a candidate to have a background in at least one of the following areas: Wafer Singulation, Solder Bumping, Maskless Photolithography, PVD and/or CVD Thin Films, Dry Etch, Wet Etch /Wafer Clean, Diffusion, Bond, Electroplate (ECD), CMP, or Metrology, Probe/Test (some areas may be combined). Work with equipment engineering and equipment maintenance technicians to drive root cause corrective actions of equipment failures, implement permanent solutions, and eliminate chronic and long-term down events. Collaborate with continuous improvement teams to drive tool matching, availability, throughput improvements and reduce risk. Management of new tool qualifications to increase fab capability, capacity, lower costs and improve yields. Work with minimal supervision, balancing competing priorities, to serve the needs of the Maintenance, Production, and Development organizations. Participate in cross-functional teams that create efficiencies across all layers of the organization. The job also requires performing other duties as assigned. Percentages of time spent on job duties are estimates and may vary for each position. Required Qualifications Education: BS Engineering (4 years exp.), MS/PhD preferred (2 years exp.) in Materials Science, Physics, Electrical or Chemical Engineering or other relevant Engineering disciplines. Proven understanding of assigned process steps and interrelation to previous and subsequent process steps in the Semiconductor manufacturing and Advanced Packaging fields. Experience with application of structured problem-solving methodology. Prior experience with Die Attach, Pic&Place, Thermal Compression Bonding, Hybrid Bonding, Compression Molding, Wafer Singulation, Grinding and Micro Ball Attach / Reflow. Positive interpersonal skills, highly energetic and self-motivated. Experience Creating and Managing Process steps. Strong Experience with set up and use of SPC Charts. Experience with Advanced Process Control Systems (APC). High level of understanding of equipment process behavior. Experience Integrating MES Software. Proficiency with analytics Software programs such as JMP and MATLAB. Demonstrated ability to meet requirements and deliver results. Ability to manage and execute multiple projects simultaneously and shift priorities to meet business needs. US Citizenship Required: This position will require the holding of, or ability to obtain, a US government security clearance. Preferred Qualifications Prior experience in Silicon Interposer and Fan Out.